Intel patent outlines embedding MicroLEDs directly into CPU package to light up wording or work as an 'extra aesthetic component'

Intel has recently filed a patent outlining a method to embed MicroLEDs directly into a CPU package. This innovative technology could potentially be used for both aesthetic purposes and to indicate various operations being performed by the electronic device. The patent, filed in 2022, was only recently published, detailing the integration of MicroLEDs into the CPU package using a glass substrate and through-glass vias (TGV).

These connections directly power and signal to the die, which can be either partially or fully embedded within the glass substrate. The purpose of the LEDs can vary, serving either an aesthetic component or an indicator of specific functions being performed by the processor. Intel specifically refers to the implementation of MicroLEDs in a CPU, suggesting the possibility of a read-out directly on the central processing unit, which, however, remains an open question.

The LEDs can also be of different colors depending on the implementation, adding to the versatility of this technology. This patent, filed over four years ago, lays the groundwork for potentially embedding MicroLEDs into a processor in the future.