Intel patent embeds MicroLEDs in chip packaging — technology may enable embedded optical interconnects through TGVs
Intel has showcased a patent it filed in 2022 to embed MicroLEDs inside chip packaging. The company suggests this could be used for diagnostic testing, customized lighting on chip surfaces, but perhaps more importantly, an alternative integration for co-packaged optics
Intel has been granted a U.S. patent that describes embedding MicroLEDs inside chip packaging, as reported by TrendForce. The design involves attaching semiconductor dies with MicroLEDs to a glass substrate and connecting them through Through-Glass-Vias (TGVs) to transmit power and signals. The embedded LEDs can emit RGB light, which Intel suggests could be used for diagnostics and personalized electronics.
This technology may also enable optical signaling, a potential commercial opportunity for Intel, particularly in partnership with Taiwanese optoelectronics firm AU Optronics. AU Optronics is working on MicroLED CPO modules for high-speed interconnect applications, and Intel's patent could potentially support such a system, though additional components like receivers and optical fibers would be needed.
Written by urgent.news from Tom's Hardware's reporting — not their text. Machine-written — may contain errors; check the original before relying on it.
