SK hynix to hold groundbreaking ceremony for Indiana chip packaging plant on Aug. 27
SK hynix will hold a formal groundbreaking ceremony for its new semiconductor packaging plant in the U.S. state of Indiana on Aug. 27, industry sources said Wednesday. The Korean chipmaker has announced plans to invest $3.87 billion into its first U.S. advanced packaging and research and development (R&D) facility in West Lafayette, Indiana, to produce high bandwidth memory (HBM) chips for…
SK hynix will host a groundbreaking ceremony for its new semiconductor packaging plant in Indiana on August 27, according to industry sources. The company plans to invest $3.87 billion in its first U.S. advanced packaging and research and development facility in West Lafayette, Indiana. This facility will focus on producing high bandwidth memory (HBM) chips for artificial intelligence applications.
SK hynix's CEO, Kwak Noh-jung, along with several CEOs and officials from leading technology firms, are anticipated to attend the event. SK Group Chairman Chey Tae-won may also be present, with reports suggesting that Nvidia CEO Jensen Huang might join as well. The collaboration between SK hynix and Nvidia has been significant, encompassing AI data center projects and the supply of memory chips and graphics processing units.
Chey and Huang have maintained frequent interactions since last year, both in Korea and the United States.
Written by urgent.news from The Korea Times's reporting — not their text. Machine-written — it may contain errors, so check the original before relying on it.
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