SK hynix to hold groundbreaking ceremony for Indiana chip packaging plant on Aug. 27
SK hynix will hold a formal groundbreaking ceremony for its new semiconductor packaging plant in the U.S. state of Indiana on Aug. 27, industry sources said Wednesday. The Korean chipmaker has announced plans to invest $3.87 billion into its first U.S. advanced packaging and research and development (R&D) facility in West Lafayette, Indiana, to produce high bandwidth memory (HBM) chips for…
SK hynix will host a groundbreaking ceremony for its new semiconductor packaging plant in Indiana on August 27, according to industry sources. The Korean chipmaker plans to invest $3.87 billion in its first U.S. advanced packaging and research and development facility in West Lafayette, Indiana. This facility will focus on producing high bandwidth memory (HBM) chips for artificial intelligence (AI) applications.
Prominent figures, including SK hynix CEO Kwak Noh-jung and officials from major technology companies, are expected to attend the ceremony. SK Group Chairman Chey Tae-won may be present, and there is speculation that Nvidia CEO Jensen Huang could also attend. Both SK hynix and Nvidia have been collaborating on global AI data center projects and supplying memory chips and GPUs. Chey and Huang have also met regularly in Korea and the United States since last year.
Written by urgent.news from The Korea Times's reporting — not their text. Machine-written — it may contain errors, so check the original before relying on it.
This story
This is one outlet's version. Read the fullest account.
