SK hynix to hold groundbreaking ceremony for Indiana chip packaging plant on Aug. 27
SEOUL, Aug. 12 (Yonhap) -- SK hynix Inc. will hold a formal groundbreaking cerem...
SK hynix Inc. plans to hold a groundbreaking ceremony for its new semiconductor packaging plant in Indiana on August 27, according to industry sources. The South Korean chipmaker has announced it will invest $3.87 billion into its first U.S. advanced packaging and research and development facility in West Lafayette, Indiana. The purpose of the facility is to produce high bandwidth memory (HBM) chips for artificial intelligence (AI) applications.
The ceremony is expected to be attended by SK hynix CEO Kwak Noh-jung, as well as CEOs and officials from major technology companies. There is speculation that Nvidia Corp. CEO Jensen Huang may also attend, given the companies' partnership in global AI data center projects. SK Group Chairman Chey Tae-won and Nvidia CEO Jensen Huang have held frequent meetings in South Korea and the United States since last year.
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