Germany's Henkel to open chip packaging materials R&D center in Seoul
German adhesives and materials maker Henkel will set up a research center in Seoul to develop packaging materials for artificial intelligence (AI) chips and high-bandwidth memory (HBM), the Seoul Metropolitan Government said Monday. The city signed a memorandum of understanding with the company at Seoul City Hall on Monday. Under the agreement, Henkel will make 12.1 billion won ($8.9 million) in…
German adhesive and materials manufacturer Henkel plans to establish a research center in Seoul, South Korea, to focus on developing packaging materials for artificial intelligence (AI) chips and high-bandwidth memory (HBM), according to the Seoul Metropolitan Government. This initiative was announced on Monday following the signing of a memorandum of understanding at Seoul City Hall.
The agreement stipulates that Henkel will invest $8.9 million in foreign direct investment in Seoul by 2031, along with the hiring of 15 new researchers, including those with master’s and doctoral degrees. The new center, named Henkel Technology Center Korea, will be situated within the Gasan Digital Complex, a prominent tech business district in Seoul’s Geumcheon District. The facility will span approximately 5,112 square meters, with 1,205 square meters specifically designated for chip packaging materials research.
This center will amalgamate Henkel’s existing research initiatives in Korea, while also introducing new research and development endeavors focused on materials specifically designed for AI chips and HBM, a specialized type of stacked memory chip utilized in AI servers. Chip packaging is the crucial process that safeguards semiconductor chips and enables their connection to other essential components.
Written by urgent.news from The Korea Times's reporting — not their text. Machine-written — may contain errors; check the original before relying on it.
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