AI Chip Race Moves Beyond HBM to Advanced Packaging
Advanced packaging is emerging as a critical factor in the global artificial intelligence semiconductor race. Even with sufficient supplies of high-bandwidth memory (HBM) and high-performance GPUs, shortages in the packaging capacity needed to integrate these components can delay shipments of finished AI accelerators. For Samsung Electronics and SK hynix, competitiveness increasingly depends on…
The global artificial intelligence semiconductor race is witnessing a shift from high-bandwidth memory (HBM) to advanced packaging as a critical factor in the industry's competitiveness. As AI accelerators become more powerful and incorporate larger amounts of HBM, the need for reliable and efficient packaging capacity to integrate these components has become increasingly important.