Germany's Henkel to open chip packaging materials R&D center in Seoul
German adhesives and materials maker Henkel will set up a research center in Seoul to develop packaging materials for artificial intelligence (AI) chips and high-bandwidth memory (HBM), the Seoul Metropolitan Government said Monday. The city signed a memorandum of understanding with the company at Seoul City Hall on Monday. Under the agreement, Henkel will make 12.1 billion won ($8.9 million) in…
German adhesives and materials manufacturer Henkel plans to establish a research center in Seoul to focus on packaging materials for artificial intelligence (AI) chips and high-bandwidth memory (HBM), according to the Seoul Metropolitan Government. The city officially signed a memorandum of understanding with the company on Monday at Seoul City Hall.
As part of the agreement, Henkel will invest $8.9 million and employ 15 researchers, including those with master’s and doctoral degrees, by 2031. The new center, named Henkel Technology Center Korea, will be situated in the Gasan Digital Complex, a tech business hub in Seoul's Geumcheon District. Spanning approximately 5,112 square meters, about 1,205 square meters will be dedicated to chip packaging materials.
The center aims to merge Henkel's current research activities in Korea with new research and development efforts centered around AI chips and HBM, a stacked memory chip utilized in AI servers. Chip packaging involves safeguarding semiconductor chips and connecting them to other components.
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