Mueon nabs $65M in funding to develop 3D computing modules

Data center hardware startup Mueon Corp. has secured $65 million in funding to develop its innovative 3D computing modules. The Series A round was led by semiconductor-focused fund Maverick Silicon, with Intel’s venture capital arm, Oregon Venture Fund, joining the investment. Other backers include Wellington Capital, IQT, and several other investors.

Mueon, founded last year by former Intel engineers Wilfred Gomes and Jack Hwang, is creating a three-dimensional server architecture called Cubelet. This technology stacks computing and memory components vertically, potentially making them 10 times more power- and cost-efficient than current hardware. Traditional servers have components arranged in a two-dimensional configuration on a motherboard.

In contrast, Mueon's Cubelet modules stack these components in a Cubelet module, which includes computing, storage, interconnect, power delivery, and thermal management equipment. Thermal management is a significant challenge in 3D computing systems, as processors and memory chips may have different maximum operating temperatures.

Mueon has reportedly developed a solution to address this issue. The company's Cubelet modules can accommodate various chips, including graphics cards and Arm central processing units. Mueon plans to use the funding to hire more engineers and enhance its system design. The company also aims to develop software that allows customers to run popular AI frameworks on its hardware.

CEO Gomes stated that this financing will enable Mueon to move beyond current rack-level constraints and deliver higher density than the rest of the industry is just beginning to chart a path toward.