Samsung showcases next-generation AI memory at OCP, highlights AMD partnership
Samsung Electronics showcased next-generation memory and storage technologies at the 2026 OCP Global Summit in the United States on Monday (local time), highlighting its efforts to improve artificial intelligence (AI) infrastructure and expand cooperation with global technology companies. The Korean tech giant jointly demonstrated a memory expansion solution with AMD and displayed products…
At the 2026 OCP Global Summit in the United States, Samsung Electronics displayed advancements in AI memory and storage technologies on Monday. The Korean tech titan aimed to enhance artificial intelligence infrastructure and strengthen partnerships with leading technology firms. Collaborating with AMD, Samsung unveiled a memory expansion solution utilizing Compute Express Link (CXL), a technology that enables processors and other computing components to share memory resources.
This innovation aids AI systems in accessing additional capacity without solely relying on memory installed directly in individual devices. Samsung also showcased products from AI chipmakers Groq and Nvidia during the event, where it served as a Diamond Sponsor. As AI models expand in size and AI agents tackle increasingly intricate tasks, the demand for greater memory capacity, faster data processing, and more efficient storage is on the rise.
Samsung's presentation addressed these challenges across three key areas: computing speed, memory expansion, and data storage. The joint CXL-based memory expansion demonstration with AMD emerged as a significant highlight of Samsung's showcase at the summit.
Written by urgent.news from The Korea Times's reporting — not their text. Machine-written — may contain errors; check the original before relying on it.
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