Samsung showcases next-generation AI memory at OCP, highlights AMD partnership
Samsung Electronics showcased next-generation memory and storage technologies at the 2026 OCP Global Summit in the United States on Monday (local time), highlighting its efforts to improve artificial intelligence (AI) infrastructure and expand cooperation with global technology companies. The Korean tech giant jointly demonstrated a memory expansion solution with AMD and displayed products…
At the 2026 OCP Global Summit in the United States, Samsung Electronics unveiled innovative memory and storage technologies aimed at enhancing artificial intelligence (AI) infrastructure. The company collaborated with AMD and showcased products from AI chipmakers Groq and Nvidia during the event, where Samsung served as a Diamond Sponsor.
As AI models become more complex and demanding, the need for increased memory capacity, faster data processing, and more efficient storage solutions is growing. Samsung presented technologies targeting these challenges across three key areas: computing speed, memory expansion, and data storage.
A notable demonstration was the joint effort with AMD to showcase a Compute Express Link (CXL)-based memory expansion solution. CXL enables processors and other computing components to share memory resources, allowing AI systems to access additional capacity without solely relying on memory installed directly in individual devices.
Written by urgent.news from The Korea Times's reporting — not their text. Machine-written — may contain errors; check the original before relying on it.
