LG Innotek shows next-gen chip substrate technology at KPCA show 2026
LG Innotek is showcasing its latest semiconductor substrate technology this week at KPCA show 2026, a three-day industry exhibition that opened Wednesday at Songdo Convensia in Incheon. Now in its 23rd year, the show — organized by the Korea PCB and Semiconductor Packaging Industry Association, known as KPCA — is Korea's largest trade exhibition dedicated to printed circuit boards and…
The LG Innotek exhibit at this year's KPCA show 2026 introduced its newest semiconductor substrate technology. Held at Songdo Convensia in Incheon, the three-day industry exhibition is Korea's largest trade show for printed circuit boards and semiconductor packaging, attracting around 350 domestic and international firms.
LG Innotek's showcase featured FC-BGA, or flip chip-ball grid array, a high-end substrate that connects semiconductor chips to a device's mainboard. For the first time, the company presented an FC-BGA specifically designed for artificial intelligence (AI) accelerators, which include graphics processing units and neural processing units. These chips manage large volumes of data at high speed. The new substrate measures over 100 millimeters per side and demands denser circuitry than conventional versions.
The company plans to commence mass production of this advanced substrate in 2027. Additionally, LG Innotek displayed chip embedding technology, which involves placing a chip within a substrate.
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