LG Innotek shows next-gen chip substrate technology at KPCA show 2026
LG Innotek is showcasing its latest semiconductor substrate technology this week at KPCA show 2026, a three-day industry exhibition that opened Wednesday at Songdo Convensia in Incheon. Now in its 23rd year, the show — organized by the Korea PCB and Semiconductor Packaging Industry Association, known as KPCA — is Korea's largest trade exhibition dedicated to printed circuit boards and…
LG Innotek is displaying its cutting-edge semiconductor substrate technology at this week's KPCA show 2026, a three-day industry exhibition that kicked off on Wednesday at Songdo Convensia in Incheon. This is the 23rd edition of the show, organized by the Korea PCB and Semiconductor Packaging Industry Association, commonly known as KPCA. It is Korea's premier trade exhibition focusing on printed circuit boards and semiconductor packaging, attracting around 350 domestic and international companies.
The exhibit highlights LG Innotek's FC-BGA, or flip chip-ball grid array, a high-end substrate that connects semiconductor chips to a device's mainboard. For the first time, the company showcased an FC-BGA designed specifically for artificial intelligence (AI) accelerators, such as graphics processing units and neural processing units, which process large amounts of data at high speed.
This new substrate measures over 100 millimeters per side and necessitates denser circuitry than conventional versions. LG Innotek plans to commence mass production of the substrate in 2027.
In addition to the FC-BGA, the company also exhibited chip embedding technology, which involves placing a chip within a substrate.
Written by urgent.news from The Korea Times's reporting — not their text. Machine-written — may contain errors; check the original before relying on it.
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