Samsung and TSMC commit to using ASML's High NA EUV machines by 2028 and 2030, joining Intel, with all four agreeing to shift from 6-inch to 12-inch photomasks (Bloomberg)

Samsung and TSMC have committed to using ASML's High NA EUV machines by 2028 and 2030, respectively. This move follows Intel's earlier adoption of the technology. According to The Korea Times, Samsung plans to introduce High NA EUV lithography into DRAM mass production by 2028.

The companies have also agreed to shift from 6-inch to 12-inch photomasks. Currently, Intel uses industry-standard 6-inch photomasks, but it is working on larger 6×12-inch photomasks.

ASML has won commitments from top chipmakers, including Samsung, TSMC, and Intel, to use its latest semiconductor production gear. The companies will work together to accelerate the development and deployment of technologies that support the increasing performance and efficiency requirements of advanced semiconductor manufacturing.

Brief written by urgent.news from Techmeme, The Korea Times, Tom's Hardware — 3 reports on this story. Machine-written — may contain errors; check the original before relying on it.