Xiaomi launches new Xring chip, partners with TSMC for production

Chinese smartphone manufacturer Xiaomi has unveiled its newest in-house Xring processor, the Xring O3, in partnership with Taiwan Semiconductor Manufacturing Company (TSMC). The O3 chip is set to power Xiaomi's upcoming foldable phone, with shipments anticipated to reach between 200,000 and 300,000 units. This move comes a year after Xiaomi launched its first proprietary handset processor, the Xring O1, and is part of the company's efforts to reduce reliance on external chip suppliers.

TSMC will manufacture the new chip using its cutting-edge 3-nanometre production technology. Xiaomi's investment in chip development amounts to over 20 billion yuan ($3 billion), and the company has over 3,000 semiconductor design engineers. The O3 is already in mass production, while the O100 and D100 chips, which will support Xiaomi's AI model and autonomous driving functions, are set for deployment next year.