Xiaomi 18 Fold Launching in September With Record-Breaking Xring O3 Chip

Xiaomi has announced its upcoming foldable smartphone, the Xiaomi 18 Fold, set to release in September 2026. This new device will be the first to feature Xiaomi's second-generation Xring O3 chipset. President Lu Weibing has already begun using the phone publicly, and pre-reservations are now available in China.

The Xring O3 chipset has achieved a remarkable score of 5,228,014 points on AnTuTu V11, becoming the first mobile flagship chip to surpass the five-million-point threshold. Manufactured using a 3nm process, the chip contains approximately 24 billion transistors, an increase from the 19 billion transistors on the previous Xring O1.

It boasts a 10-core CPU, with the C1-Ultra cores running at up to 4.35GHz, four C1-Premium cores at 3.68GHz, and four C1-Pro cores at up to 3.15GHz. In Geekbench 6, Xiaomi reports a 15,221 multi-core score, indicating a 60% improvement over the previous generation. Single-core performance reaches around 3,945 points.

The Xring O3 also introduces significant upgrades in graphics and AI performance. Its 16-core G2-Ultra NX GPU delivers up to 85% better conventional GPU performance and up to 182% better ray-tracing performance compared to the Xring O1. Power consumption can be decreased by 64% when handling equivalent performance. Additionally, the chipset becomes the first mobile processor to support LPDDR6 memory, offering bandwidth up to 113.8GB/s, which is 48% higher than its predecessor.

Moreover, the redesigned Neuro Processing Unit (NPU) in the Xring O3 provides up to 200 TOPS of tensor computing performance, optimized for Xiaomi's MiMo on-device AI models. Overall on-device AI performance has improved by 45%. Complete specifications, pricing, and availability for the Xiaomi 18 Fold will be unveiled as the launch date approaches.