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[Insight] Beyond HBM: SK hynix Maps the Next AI Battleground in Optical Interconnects

SK hynix has outlined a roadmap for co-packaged optics, or CPO, that could extend the company’s role in AI infrastructure beyond HBM and into the high-speed optical links connecting processors, memory…

  • SK hynix plans to integrate optical interconnects into AI infrastructure beyond HBM.
  • Research in Nature Electronics outlines a roadmap for high-speed connectivity.
  • Goal is 100 Tb/s bandwidth per node with low power consumption and latency.

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