Fund backed by China memory giant YMTC invests in push for alternative chipmaking route
A venture capital fund backed by Yangtze Memory Technologies Corp (YMTC), China’s top producer of NAND flash memory, has taken a stake in domestic semiconductor manufacturer SOI Micro, adding a high-profile investor to the country’s push for an alternative chipmaking ecosystem. Led by a prominent figure in China’s semiconductor industry, SOI Micro is focused on developing fully depleted…
A venture capital firm, heavily backed by China's leading NAND flash memory producer Yangtze Memory Technologies Corp (YMTC), has recently invested in SOI Micro, a domestic semiconductor manufacturer. This move adds significant weight to China's efforts to develop an alternative chipmaking ecosystem. SOI Micro specializes in fully depleted silicon-on-insulator (FD-SOI) technology, a low-power chipmaking process that offers a different route to mainstream manufacturing methods.
The Shanghai-based company was recently upgraded to a 2.53 billion yuan (US$375 million) registered capital from its previous 2.39 billion yuan, with the Wuhan-based Changcun Industry Investment Fund as the new investor. The size and exact stake of this investment were not disclosed. The Changcun Industry Investment Fund, established in 2023, is a joint venture between YMTC and the Hubei Integrated Circuit Industry Investment Fund, a state-backed entity in Wuhan.
While the fund has primarily focused on memory-chip supply-chain players, this investment in SOI Micro broadens its scope into specialized logic manufacturing. Soi Micro, founded in Guangzhou in 2022, is led by Ye Tianchun, a renowned semiconductor specialist who previously headed China's Institute of Microelectronics within the Chinese Academy of Sciences and served as chief technologist for a prominent state project aimed at advancing domestic chipmaking technologies.
SOI Micro's primary focus is on a FD-SOI manufacturing platform for 28-nanometre-class logic processes. The technology uses a thin layer of silicon over an insulating layer to reduce leakage and power consumption, serving as a complementary approach to FinFET, a 3D chip design meant to prevent power leaks. Major players like Taiwan Semiconductor Manufacturing Company (TSMC) and Samsung Electronics use FinFET technology across their process nodes, while Guangzhou has promoted FD-SOI to foster a unique semiconductor industry in the region.
Ye Tianchun has described FD-SOI as a "second track" for the Greater Bay Area's chip sector. The company is also deeply connected to Guangzhou's broader FD-SOI initiatives, with the Guangdong Greater Bay Area Institute of Integrated Circuit and System Application, established in 2019 and directed by Ye, focusing on FD-SOI processes, devices, and materials.
Public updates on this institute's progress remain scarce. SDIC Venture Capital, which lists SOI Micro among its portfolio, revealed that the company has developed a process design kit and is collaborating with Wuhan-based foundry XMC on a production line. The investment firm stated that SOI Micro aims for small-volume production in 2025 and has secured contracts with several chip-design companies, though they did not confirm whether these production targets were met.
Written by urgent.news from SCMP Tech's reporting — not their text. Machine-written — may contain errors; check the original before relying on it.
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