Multiphysics moves to the heart of semiconductor design as Synopsys brings multiphysics into the chip-design workflow

For decades, the semiconductor design process was divided into two distinct stages: implementing logical functionality with electronic design automation (EDA) software, followed by multiphysics simulation to analyze electromagnetic, thermal, and mechanical properties. However, as devices become larger, more complex, and circuits are packed more densely onto semiconductor chips, the separation between these stages is blurring.

Late-stage fixes can involve adjusting the locations of billions of transistors or millions of wires, which is both expensive and time-consuming. To avoid costly modifications, designers must closely monitor the interactions between thermal, electromagnetic, and mechanical properties during the design process. Synopsys is addressing this issue by integrating Ansys multiphysics simulation and analysis technologies into its EDA workflows.

This integration allows engineers to account for multiphysics effects earlier in the design process, starting with architectural definition and extending through physical design and layout, rather than just before signoff. By considering multiphysics throughout the design process, designers can avoid overdesign, reduce performance issues, and lower costs.

Key effects addressed by multiphysics include IR drop and electromigration, electromagnetic coupling, and thermal management.