Samsung Chairman Lee Inspects Japan Packaging Lab as AI Chip Race Intensifies
Samsung Electronics is investing 40 billion yen, or approximately $253.53 million, over five years in its Advanced Package Lab (APL), a semiconductor packaging research hub in Yokohama, Japan, as it seeks to strengthen its competitiveness in artificial intelligence (AI) semiconductors. Samsung Elect
Samsung Electronics is committing 40 billion yen, or roughly $253.53 million, over five years to its Advanced Package Lab (APL) in Yokohama, Japan. CEO Lee Jae-yong inspected the facility on November 1st to monitor advances in next-gen semiconductor packaging research and potential collaborations with Japanese suppliers. This was Lee's first visit since the lab opened in September.
The APL, a joint research hub linking Samsung's design/manufacturing with Japan's materials/technology ecosystem, focuses on developing next-gen AI semiconductor materials and structures. Japanese companies like Uemura, Disco, and Resonac will supply key materials and equipment. The Japanese government is subsidizing 22.5 billion yen (190 billion won) to bolster Samsung's AI semiconductor investment.
Advanced packaging is now a crucial determinant of chip performance and power efficiency, as miniaturization limits traditional performance gains. Samsung plans to boost its R&D synergy with domestic semiconductor research centers in Giheung and Hwaseong, as well as its Cheonan plant. Lee has recently visited other Samsung facilities to maintain technological leadership.
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