Madhya Pradesh advances ₹6,200 crore semiconductor packaging project
Madhya Pradesh has placed a proposed ₹6,200 crore advanced semiconductor packaging facility at the centre of its investment strategy as Chief Minister Mohan Yadav unveiled fresh technology commitments at the Semiconductor Summit 2026 in Indore. The two-day summit, inaugurated on Friday at the Brilliant Convention Centre, attracted investment proposals worth approximately ₹5,800 crore, potentially…
Madhya Pradesh has announced a ₹6,200 crore semiconductor packaging project, unveiled by Chief Minister Mohan Yadav at the Semiconductor Summit 2026 in Indore. The summit brought together over 1,000 delegates from Japan, South Korea, Taiwan, and Sweden, with investment proposals totaling approximately ₹5,800 crore. Five companies received letters of intent for land allocation covering projects worth ₹9,625 crore.
The proposed semiconductor facility, involving Paras Semiconductors, aims to create around 10,000 jobs and utilizes advanced packaging technologies for AI accelerators, high-performance computing, and specialized processors. The Indore-Ujjain corridor has been identified as the site, with approximately 50 acres allocated for development.
The government has also planned a Semiconductor Centre of Excellence and a Centre of Excellence for Photonics and Quantum Technologies to support research and workforce development. The proposed 3D artificial intelligence chip packaging facility, if implemented, will make India the first operational AI chip packaging facility. The government offers financial incentives, including capital assistance and subsidized electricity, to attract investment into the semiconductor sector.
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