Intel installs production tools at Fab 62 in Arizona, provides updates on Ohio chip fab
Intel makes progress on its manufacturing expansion in Arizona and Ohio as it continues to expand advanced semiconductor manufacturing capacity in the U.S.
Intel has commenced production tool installation at its Fab 62 in Arizona, aiming for mass production by late 2028. The company has also reported advancements at its Ohio One manufacturing complex and confirmed the integration of High-NA EUV lithography into high-volume manufacturing. Intel continues to invest in U.S. leading-edge process technology R&D, advanced packaging, and photomask production capabilities, positioning itself ahead of competitors.
Intel's Fab 62, a sixth high-volume semiconductor manufacturing facility at its Ocotillo campus, will be able to produce chips on 18A, 18A-P, and 14A nodes, but it has not yet been assigned to Intel 14A. Meanwhile, Intel's Ohio One complex in New Albany, Ohio, has installed its first major structural truss, marking progress in the company's domestic chip production strategy.
Intel also confirmed the use of High-NA EUV lithography in mass production for selected tiles of its Panther Lake CPUs, but the benefits of this technology over existing lithography scanners remain unclear.
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