Intel installed the first major truss at its delayed Ohio chip plant
The first Ohio fab is targeted for completion in 2030, with a second planned for 2031 at the New Albany site
Intel has commenced production tool installation at its Fab 62 in Arizona, aiming for mass production by late 2028. The company has also reported advancements at its Ohio One manufacturing complex and confirmed the integration of High-NA EUV lithography into high-volume manufacturing. Intel continues to invest in U.S. leading-edge process technology R&D, advanced packaging, and photomask production capabilities, positioning itself ahead of competitors.
Intel's Fab 62, a sixth high-volume semiconductor manufacturing facility at its Ocotillo campus, will be able to produce chips on 18A, 18A-P, and 14A nodes, but it has not yet been assigned to Intel 14A. Meanwhile, Intel's Ohio One complex in New Albany, Ohio, has installed its first major structural truss, marking progress in the company's domestic chip production strategy.
Intel also confirmed the use of High-NA EUV lithography in mass production for selected tiles of its Panther Lake CPUs, but the benefits of this technology over existing lithography scanners remain unclear.
Written by urgent.news from Tom's Hardware's reporting — not their text. Machine-written — may contain errors; check the original before relying on it.
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