Samsung to use TSMC technology for Nvidia's next-generation memory chips: Report
Nvidia has asked Samsung, SK Hynix and Micron Technology to use TSMC's process for NVHBM base dies, and sixth-generation DRAM technology for its core dies, the newspaper said, citing industry sources.
Seoul Economic Daily disclosed that Samsung Electronics will employ TSMC's 3-nanometre process for producing base dies of Nvidia's upcoming high-bandwidth memory (HBM) chips. This marks Samsung's first collaboration with TSMC at the HBM manufacturing level, according to the report. Nvidia has enlisted Samsung, SK Hynix, and Micron Technology to utilize TSMC's process for Nvidia HBM base dies and sixth-generation DRAM technology for core dies.
NVHBM, introduced in August, incorporates Nvidia's custom memory controller into the base die, aiming to standardize implementation across various memory suppliers. Samsung has accepted Nvidia's specifications following an internal evaluation, but intends to maintain its proprietary production model for standard HBM and custom products for other clients.
The company is also exploring whether its foundry could manufacture NVHBM base dies if the demand surpasses TSMC's capacity, as per an unnamed source cited by the newspaper.
Written by urgent.news from The Business Times - Companies & Markets's reporting — not their text. Machine-written — may contain errors; check the original before relying on it.
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