Nvidia and Cisco announce new optical module for AI data centers

Nvidia and Cisco have unveiled a new high-density optical module called Ultra-Dense Small Form Factor Pluggable (USFP) designed for AI data center networks. The USFP module supports 400Gb/s-per-lane electrical signals with a capacity of up to 12.8Tb/s. The first transceivers in this lineup will feature 16 full-duplex lanes in an octal small form factor footprint, with the potential to expand to 32 lanes in the future.

This module delivers four times the bandwidth density compared to its 200Gb/s-per-lane counterparts and offers approximately 1.3 times the power efficiency. It operates within a power dissipation limit of 100 watts without the need for an additional cooling circuit within the transceiver. The module utilizes a two-dimensional array connector with a two-step insertion design aimed at minimizing contact wear and enhancing signal integrity.

This innovative connector technology is scalable to support up to 32 full-duplex lanes and beyond. Gilad Shainer, senior vice president at Nvidia, emphasized that building the world's largest AI factories hinges on reimagining the smallest connections. Cisco's Bill Gartner agreed, stating that the companies are creating an ecosystem to reinvent pluggable optics with USFP.

Nvidia and Cisco are collaborating with TE Connectivity and Amphenol to develop USFP cages, connectors, and modules. The companies plan to establish an open industry specification for USFP through a community-led multi-source project. This report is AI-generated and reviewed by an editor.