TSMC taps GlobalFoundries to bolster US silicon interposer production in $2B deal

US semiconductor manufacturer GlobalFoundries has teamed up with Taiwan Semiconductor Manufacturing Company (TSMC) in a $2 billion deal to bolster American production of advanced semiconductors. This collaboration aims to address the supply chain gap in the United States, particularly in the production of key components like silicon interposers. These interposers are crucial for multi-die chip assemblies, such as GPUs and AI accelerators, by enabling faster and more power-efficient communication between chips.

GlobalFoundries will manufacture silicon interposers for TSMC's Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging standard at its facility in Malta, New York. This partnership is a significant step towards closing the domestic supply chain void, as existing US facilities are not expected to be operational until 2028-2029. The deal is set to last for five years, with an option for extension.

While other options like Intel's advanced packaging technology exist, the CoWoS packaging remains the most popular choice. Intel has also offered leading-edge process and advanced packaging capabilities, but these are compatible with chips produced at TSMC's facilities. With this partnership, customers may not have to wait for the completion of TSMC and Amkor's facilities to manufacture chips in America.