Murata Begins Mass Production of World’s Smallest 0201-inch Size Three-Terminal Low-ESL MLCCs

Murata Manufacturing Co., Ltd., a global leader in ceramic-based passive electronic components, has commenced mass production of its latest innovation - the LLD series of three-terminal low-equivalent series inductance (ESL) multilayer ceramic capacitors (MLCCs). These new capacitors are a record 0201-inch size, measuring just 0.6 × 0.3 mm, which is 64% smaller than the company's previous smallest 0402-inch version.

This compact sizing offers significant advantages for electronic devices, particularly smartphones and wearables, which often incorporate powerful integrated circuits (ICs). Maintaining a stable power supply becomes increasingly challenging as high-speed ICs generate rapidly changing currents, leading to voltage fluctuations. The three-terminal design of these new Murata capacitors mitigates this issue by providing four shorter current paths, resulting in lower ESL compared to conventional two-terminal capacitors.

Miniaturization of three-terminal capacitors has historically been challenging due to their complex internal and external electrode structures. Murata has addressed this hurdle by optimizing electrode design and advancing manufacturing processes. The result is a product line that enables high-density mounting while ensuring voltage stabilization near ICs, even at high frequencies.

This versatility allows designers more freedom in component placement and circuit design, supporting improved performance in space-constrained electronic devices.

Two models are now available. The LLD033R60G105ME01 features a capacitance of 1 µF and a rated voltage of 4 Vdc, with an operating temperature range of -55 to +85°C. The second model, LLD033D80E105ME01, also offers 1 µF capacitance but has a lower rated voltage of 2.5 Vdc and an extended operating temperature range of -55 to +105°C.

Murata remains committed to developing compact, high-performance MLCCs for mobile and wearable devices. This latest advancement promises to further miniaturization and enhance the overall performance of electronic equipment.