GMIF2026 Innovation Summit concludes semiconductor memory conference in Shenzhen
The Shenzhen Memory Industry Association co hosted the fifth GMIF2026 Innovation Summit in Shenzhen convening industry leaders to examine artificial intelligence memory architectures and storage infrastructure
On September 23, the 5th GMIF2026 Innovation Summit concluded in Shenzhen, bringing together industry leaders from various sectors to discuss the future of memory and storage technologies. Co-hosted by the Shenzhen Memory Industry Association (SMIA) and Peking University's School of Integrated Circuits, the summit explored AI-driven memory and storage trends and innovations.
The event featured discussions on key topics such as inference efficiency, enterprise-grade storage, cloud-edge-device coordination, industrial capital, and the evolving global competitive landscape. President of the SMIA, Rixin Sun, reflected on the summit's growth since its inception in 2019, highlighting its increasing influence and specialization in tracking frontiers of industry trends and supply-chain coordination.
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