Chinese chip foundry CanSemi’s IPO oversubscribed 2,360 times as investors chase AI boom
Chinese chip foundry CanSemi Technology’s Shenzhen initial public offering (IPO) is emerging as one of mainland China’s most sought-after tech listings this year, as investors bet on its push into silicon photonics and its role in domestic artificial intelligence infrastructure. The Guangzhou-based company’s retail tranche was oversubscribed by more than 2,300 times after clawback, according to a…
Chinese semiconductor manufacturer CanSemi Technology's initial public offering (IPO) in Shenzhen drew unprecedented investor interest, being oversubscribed by an astounding 2,360 times after accounting for clawbacks. This surge in demand reflects the company's strategic focus on silicon photonics and its pivotal role in the burgeoning domestic artificial intelligence infrastructure.
Established in 2017, CanSemi has positioned itself as Guangzhou's leading chip company, specializing in mature-node semiconductors for analog and mixed-signal applications in power management, automotive electronics, and industrial sensors. The standout aspect of CanSemi's strategy lies in its investment in silicon photonics technology, which utilizes light to transmit data and is increasingly regarded as a cornerstone for next-generation AI infrastructure.
With a 90-nanometer silicon photonics platform launched in late 2024, the company aims to transition to 65nm process nodes. In April 2026, CanSemi will become the sole entity in mainland China capable of mass-producing 12-inch silicon photonic wafers on a large scale, according to its prospectus. Backed by state-owned investors and industrial funds, CanSemi's IPO pricing at 12.01 yuan per share aimed to raise 7.5 billion yuan.
The retail tranche was oversubscribed by 14.4 million online accounts, leading to a final oversubscription rate of 2,360 times.
Written by urgent.news from SCMP Tech's reporting — not their text. Machine-written — may contain errors; check the original before relying on it.
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