SK hynix Looks Beyond HBM as AI Memory Race Enters Next Phase

SK hynix is expanding its focus beyond high-bandwidth memory (HBM) as the rapidly growing artificial intelligence industry propels memory technologies into a new era. The company held its annual 2026 Global Forum in Santa Clara, California to discuss emerging AI memory technologies and the future direction of the semiconductor industry. SK hynix CEO Kwak Noh-jung emphasized that the company aims to build on its HBM leadership and open new opportunities for AI through next-generation memory.

The AI industry relies heavily on memory, with demand expected to remain strong as AI models become larger and require faster data transfer between processors and memory. HBM has become a critical component in AI computing systems. However, the next stage of competition will likely extend beyond memory bandwidth, as system performance increasingly depends on the integrated performance of memory, processors, advanced packaging, and system architecture. Power efficiency and capacity are also essential considerations as AI infrastructure scales.

This transition from individual technology performance improvements to integrated system optimization was highlighted during this year's Global Forum, which featured discussions on design, process and device technologies, advanced packaging, and systems. SK hynix showcased its HBM portfolio and other memory technologies during the forum.

In response to the increasing demand for AI memory, SK hynix is expanding its manufacturing and research infrastructure globally. In Korea, the company is developing the Yongin Semiconductor Cluster as a major production base. In the United States, SK hynix is establishing an advanced packaging facility in Indiana and planning a global AI R&D center to strengthen its access to technology partners and the American AI ecosystem.

By expanding its production bases and research infrastructure, SK hynix aims to maintain its technological competitiveness as the AI memory market evolves. The company's strategy reflects a broader shift in the semiconductor industry, where memory suppliers must work more closely with customers and technology partners across chip design, packaging, and system development.

SK hynix has used its Global Forum as a platform to connect with industry professionals and researchers, presenting its technology roadmap alongside its strategic initiatives like the Yongin cluster, Indiana project, and planned U.S. AI R&D center.