Global chip leaders see India emerging as semiconductor manufacturing hub

India aims to train one lakh semiconductor technicians, clean-room personnel, and factory-floor workers under the Semicon 2.0 initiative, stated Electronics and Information Technology Minister Ashwini Vaishnaw. Speaking at SEMICON India 2026 in New Delhi, Vaishnaw outlined the program's six focus areas: chip design, machinery and materials, fabrication facilities (fabs), advanced packaging, research and development, and talent cultivation.

Prime Minister Narendra Modi, who inaugurated the event, emphasized that India's semiconductor journey is progressing from "files to factories" as more projects transition from approvals to manufacturing and commercial production. Modi highlighted that India is developing domestic capabilities across the entire technology value chain rather than focusing solely on semiconductor manufacturing.

Semicon 2.0, approved by the Union Cabinet in July, carries a budget of ₹1,27,500 crore, compared to ₹76,000 crore in the first phase. The government aims to target at least 200 chip-design startups and companies across the spectrum of semiconductor requirements. A co-investment model will be introduced for chip startups, with the government matching venture capital investments on the same terms.

The program's second pillar will focus on equipment and materials, including semiconductor machinery, chemicals, gases, and maintenance capabilities. The third and fourth pillars will concentrate on establishing more semiconductor fabs and advanced packaging facilities. The fifth pillar, research and development, will prioritize applied projects driven jointly by industry and academia.

The sixth pillar, talent development, will expand beyond designing engineers to include technicians, clean-room personnel, and factory-floor workers, with the government aiming to train one lakh such workers to support upcoming semiconductor factories in India.