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AI Made A Lot Of "Hideous" Code But Found Major Bottlenecks For Faster Linux Compilation

An ARM Linux engineer leveraged AI/LLMs to help uncover some improvements to "significant speed up" the Linux kernel build times. In the process the LLM used generated "a lot of code, much of it hideous" but in the end was used to find some very significant time savings for faster kernel builds via more task parallelization in different areas of the kernel build process...

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Samsung Electro-Mechanics Showcases Next-Generation Substrate Technologies for AI Chips

Samsung Electro-Mechanics is showcasing a broad range of advanced semiconductor substrate technologies designed to support the growing demand for artificial intelligence and high-performance computing…

  • Samsung Electro-Mechanics unveils next-gen semiconductor substrate technologies at KPCA Show 2026.
  • Focus on 2.5D and 2.1D package substrates for AI semiconductors.
  • Highlights glass substrates, automotive FCBGA, and smartphone co-package solutions.

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