Big chipmakers are already committed to using ASML's next-generation production technology by as soon as 2028
High NA EUV and even 12-inch photomasks.
Samsung and TSMC are set to utilize ASML's next-generation high NA EUV manufacturing technology starting as early as 2028 and 2030, respectively, according to ASML, the exclusive EUV machine producer. High NA EUV stands for high numerical aperture extreme ultraviolet, a cutting-edge chipmaking technology found in ASML's most advanced machines.
This advanced technology enables faster production, higher yields, and denser wafers, streamlining the chipmaking process and reducing production steps. ASML is also working with Nvidia and Apple to transition from 6-inch to 12-inch photomasks, which will increase scanner productivity and pave the way for 12-inch High-NA lithography systems to enter advanced node production by 2033.
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