TRUMPF develops HiPIMS technology for advanced semiconductor glass substrate coating

Dittingen, Germany and Taipei, Taiwan - Media OutReach Newswire - September 1, 2026 - The push for more powerful AI processors is driving demand for advanced packaging techniques. To fit more computing capacity into a smaller surface area, manufacturers are turning to glass substrates as a solution. These substrates allow for greater integration of functions and faster data transmission within chips.

However, producing these substrates requires drilling millions of precise microscopic holes and then coating them with a conductive material. TRUMPF, a high-tech company, has developed a new industrial process called HiPIMS (High-Pressure Chemical Vapor Phase Sputtering) that can produce these high-quality coatings consistently.

With its HiPIMS technology, TRUMPF is helping the semiconductor industry bring glass substrates for advanced AI processors to large-scale production. The HiPIMS process generates highly ionized plasma with a greater proportion of electrically charged particles than traditional methods. These ions can be precisely controlled and directed into deep, narrow through-holes, resulting in a more uniform coating.

This leads to a higher density of deposited molecules, improving the quality of the coating. TRUMPF's HiPIMS technology enables process stability, improved production yield, and cost-effective mass production of future AI chips. TRUMPF has decades of experience implementing HiPIMS technology in industrial settings and has continuously refined the process.

The company offers additional advanced packaging technologies such as ultrashort-pulse lasers and plasma power supplies, forming a comprehensive foundation for producing high-performance AI chips, data center processors, and high-performance computers.