TRUMPF deploys ultrashort pulse lasers for direct microchip cooling systems
Industrial manufacturer TRUMPF utilized ultrashort pulse laser systems to build internal microstructures within semiconductor chip stacks enabling direct thermal management for high performance artificial intelligence processors
Dittingen, Germany and Taipei, Taiwan - At Semicon Taiwan, TRUMPF unveiled an innovative ultrashort-pulse laser application for the industrial production of cooling systems integrated into AI chips. As heat dissipation becomes a bottleneck for future AI processors, novel cooling concepts are essential to meet the high demands. TRUMPF's technology allows cost-effective production of microstructures necessary for integrated cooling systems on an industrial scale.
With the ability to flexibly integrate cooling structures into the chip stack, TRUMPF's lasers enable chip manufacturers to address the increasing heat generation inside chip stacks. The process is suitable for various materials, including silicon carbide and diamond, both of which efficiently dissipate heat. However, manufacturing the required microstructures poses significant challenges due to silicon carbide's hardness and the small size of the structures.
TRUMPF's ultrashort-pulse lasers (USP) excel in ablation with micrometer precision, creating fine structures at an accelerated processing speed of at least five times faster than etching processes. This ensures excellent surface quality and precise geometry, meeting the semiconductor industry's requirements for quality and cost-effectiveness simultaneously.
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