Sinergi 5 syarikat mampu pacu semikonduktor bernilai tinggi, kata pakar

Malaysia plans to boost its semiconductor packaging capabilities over the next two years through the establishment of the Malaysia Advanced Packaging Consortium (MAPC), involving five local semiconductor companies. According to the minister, pooling resources under MAPC could generate higher value compared to funding five separate companies.

This approach allows experts from various fields to collaborate on IC design, process development, deployment, testing, automation, and equipment. The consortium's strength lies in the ability of each company to complement the others in building a comprehensive advanced packaging network within the country. However, Chan emphasized that MAPC's true test is whether it can translate the public-private investment into domestically competitive semiconductor packaging capabilities and a global global market presence.

The project requires engagement with customers, clear product validation from the onset, and a focus on commercialization alongside capacity building to ensure research continues after funding ends. The value of the program should also be assessed by its ability to generate local engineers capable of optimizing processes, increasing output and reliability, enhancing equipment, and building their own expertise.

Ultimately, the success of this initiative will contribute to a broader Malaysian semiconductor ecosystem encompassing all five MAPC companies.