SK Hynix weighs Intel for HBM4E base dies, Herald Economy reports
SK Hynix, a major memory manufacturer, is exploring the possibility of manufacturing the base dies for its upcoming HBM4E memory using Intel's foundries, according to the Herald Economy. This move aims to diversify SK Hynix's supply chain, which currently heavily relies on Taiwan Semiconductor Manufacturing Co (TSMC). The report, citing industry sources, suggests that SK Hynix could potentially work with both TSMC and Intel for base-die production, which is expected to start with HBM4E, the company's seventh-generation HBM product.
The base die, a crucial component at the bottom of an HBM stack, plays a significant role in controlling the interface between the memory and external processors like GPUs and CPUs. As HBM designs have become more complex, SK Hynix has moved from producing base dies internally to outsourcing production for HBM4. Industry estimates suggest that the cost of TSMC's HBM4 base die is three to four times that of the core DRAM die, presenting a substantial cost burden for HBM4E development.
With Intel potentially stepping in as a manufacturing partner, SK Hynix could gain more control over pricing and supply security. This strategy would also enhance the company's manufacturing structure, especially as demand for customized HBM increases. SK Hynix has been evaluating advanced packaging technologies from both TSMC and Intel, including CoWoS-S and CoWoS-L from TSMC and EMIB from Intel.
This potential partnership with Intel is currently under consideration and not a finalized agreement, so the specifics of any Intel involvement remain unclear. SK Hynix recently shipped samples of its 12-layer HBM4E to major customers in June, boasting up to 16Gbps per pin and over 20% higher power efficiency than previous generations.
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