SK hynix holds groundbreaking ceremony for HBM production base in U.S.

South Korean chipmaker SK hynix held a groundbreaking ceremony for an advanced packaging production facility for artificial intelligence memory in Indiana, aiming to produce hundreds of thousands of wafers annually. The facility, with an estimated total investment of over US$4 billion, will be SK hynix's first next-generation High Bandwidth Memory (HBM) production hub in the United States.

The cleanroom is expected to open by October 2028, with mass production of next-generation HBM beginning in the second half of 2029. SK hynix plans to strengthen the U.S. semiconductor supply chain and contribute to national and economic security by providing a new source of made-in-U.S. HBM.

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