DayOne seeks loan to fund Hong Kong data centre ahead of US IPO
This comes amid efforts to raise funds to expand its global footprint as demand for AI capacity surges
DayOne Data Centers, a Singapore-headquartered data centre operator, is seeking a HK$1.86 billion (US$237 million) loan to fund its Hong Kong data centre expansion ahead of a planned US IPO. The loan, which would be provided by a consortium of Asian banks including DBS, OCBC, and UOB, is part of the company's efforts to raise funds to expand its global footprint as demand for artificial intelligence capacity surges.
The loan talks come amid a recent borrowing spree for the company, including a four-year, S$530 million (US$417 million) loan obtained from DBS, OCBC, and UOB to develop its first Singapore-based data centre.
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