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SK hynix Turns to Optical Links to Break AI’s Data Bottleneck

As the computing performance of AI accelerators grows roughly threefold every two years, bandwidth between chips has increased by only about 1.4 times, making the so-called bandwidth wall an…

  • SK hynix uses optical interconnects to overcome AI data bottlenecks
  • Co-packaged optics (CPO) integrates optical transceivers with processors
  • Targets include 100Tbps bandwidth, 1 pJ/bit energy consumption, and 10ns latency

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