Lee Jae-yong Pledges 46 Trillion Won Investment to Transform Onyang Campus into HBM Hub

Samsung Electronics Chairman Lee Jae-yong announced a 46 trillion won investment plan to convert Samsung’s Onyang Campus in Asan, Chungcheong Province, into a leading advanced packaging hub for high-bandwidth memory (HBM) chips, a critical component in artificial intelligence (AI) technology. Over the next phases, Samsung plans to construct five HBM production lines, converting the current semiconductor assembly and testing facility into a modern HBM manufacturing base.

During the campus's groundbreaking ceremony, Lee emphasized the shift from a traditional semiconductor assembly and testing site to a cutting-edge HBM hub, describing it as the "heart of AI semiconductors." The company will allocate 6 trillion won to construction and 40 trillion won to advanced equipment, culminating in a campus expansion from 270,000 to approximately 420,000 square meters, an increase of about 60%.

Once operational in June 2028, the new facility will generate around 700 direct jobs. The project is part of a broader strategy to enhance Samsung's competitiveness in the advanced packaging sector, aligning with the growing demand for AI accelerators and data centers. Samsung's investment also aims to bolster the semiconductor ecosystem in the Chungcheong region, combining existing infrastructure in Cheonan and Asan with new HBM capabilities.