South Korea's Lee says Samsung chip packaging expansion to spur $30 billion additional investment
Lee made the comment during a groundbreaking ceremony for part of theinvestment plans that Samsung affiliates announced in July.
President Lee Jae Myung of South Korea announced on Thursday that Samsung Electronics has invested 6 trillion won ($4.48 billion) in a high-bandwidth memory (HBM) chip packaging plant in Asan, South Korea. The company plans to follow this with an additional 40 trillion won in investment in advanced equipment. Lee made this statement during a groundbreaking ceremony for part of the investment plans announced by Samsung affiliates in July.
Samsung Electronics revealed in a presentation that the new HBM production line is set to begin operations in June 2028, which is a year earlier than initially planned. The company aims to meet the rapidly growing demand for server memory. The new HBM plant will feature three floors of clean-room space covering approximately 31,000 square meters (37,076 square yards).
South Korea's government has enlisted Samsung, fellow chipmaker SK Hynix, and other companies to aid in driving mega projects encompassing semiconductors, artificial intelligence, and AI data centers.
Written by urgent.news from CNA - Business's reporting — not their text. Machine-written — may contain errors; check the original before relying on it.
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