Samsung, AMD Join Forces to Upgrade Semiconductor Test Infrastructure
Samsung Electronics is partnering with U.S. semiconductor company AMD to enhance the performance of next-generation semiconductor manufacturing test infrastructure. The collaboration aims to combine Samsung Electronics’ advanced memory solutions with AMD’s high-performance processors to rapidly proc
Samsung Electronics and AMD have joined forces to upgrade semiconductor test infrastructure by combining Samsung's advanced memory solutions with AMD's high-performance processors. The collaboration involves integrating Samsung's DDR5 RDIMM and MRDIMM memory, PCIe Gen 6-based PM1763 SSD, and CXL 3.2-based memory module, the CMM-D MD310, with AMD's latest embedded CPU, the EPYC Embedded 9006 Series SP7.
This partnership aims to enhance the performance of next-generation semiconductor manufacturing test infrastructure by delivering higher bandwidth and greater computing capacity as memory and I/O technologies continue to advance. AMD plans to begin shipping the 128-core model in the EPYC Embedded 9006 Series on November 15, with the remaining lineup expected to follow by the end of the year.
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