Doosan Showcases High-End CCLs for AI Infrastructure at electronica 2026
Doosan is stepping up efforts to expand its presence in the European electronics materials market by showcasing high-end copper-clad laminates (CCLs) designed for artificial intelligence (AI) infrastructure at electronica 2026 in Munich, Germany.Doosan said on Nov. 11 that it is participating in electronica 2026, held from Nov. 10 to 13, where it is presenting a range of electronic materials and…
Doosan is set to showcase its high-end copper-clad laminates (CCLs) for AI infrastructure at electronica 2026 in Munich, Germany. The exhibition, one of Europe’s largest for electronic components and systems, will feature Doosan’s CCLs for AI accelerators, optical modules, and other components essential for AI data centers and servers.
The company highlights the low dielectric constant (Low Dk) and low dielectric loss (Low Df) characteristics of these CCLs to minimize signal loss and enable faster data transmission. Additionally, Doosan is demonstrating its patterned flat cable (PFC) for electric vehicle battery systems, which can reduce weight and volume by over 80% compared to conventional copper wiring harnesses, thus improving vehicle efficiency and extending driving range.
The company also plans to use insights gathered from the event to guide future product development and engage in follow-up discussions with potential customers.
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