Catch Electronics Shock and Drop Failures Before Hardware Is Built
Learn how guided virtual shock and drop analysis helps engineering teams identify reliability risks before physical testing, reduce qualification iterations, optimize packaging designs, and accelerate electronics product development. What you will learn about: Why shock failures found during physical qualification are costly, and how coupled electrical, mechanical, thermal, and packaging effects…
Engineering teams can uncover reliability risks in electronics design through virtual shock and drop analysis, streamlining product development. This innovative approach helps identify the costly nature of shock failures during physical qualification tests. The complex interplay of electrical, mechanical, thermal, and packaging factors makes these failures difficult to predict.
Traditional simulation methods and physical drop testing each introduce gaps in timing, expertise, setup effort, and diagnostic detail. Guided, template-based virtual workflows, however, can model various drop scenarios, including tilt drops, ball impacts, and packaged drops, adhering to IEC 60068-2-27 and IEC 60068-2-31 standards.
Employing the complete drop orientation matrix in a single validation plan supports packaging optimization and cultivates confidence in the hardware before it is finalized. This whitepaper offers a valuable resource for teams aiming to enhance electronics product development through virtual shock and drop analysis.
Written by urgent.news from IEEE Spectrum's reporting — not their text. Machine-written — may contain errors; check the original before relying on it.
