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'Porous anchor' that strongly bonds dissimilar materials formed simply by coating and drying

The National Institute for Materials Science has developed a technology to strongly bond dissimilar materials by using a porous layer, formed by a solution-coating and drying process, as an anchor. The research team confirm that even materials that are normally difficult to bond together can be bonded with a strength exceeding 7 MPa by adopting a hybrid approach: adhering to one material through…

'Porous anchor' that strongly bonds dissimilar materials formed simply by coating and drying

The National Institute for Materials Science has developed a new technology that can bond dissimilar materials with exceptional strength using a porous anchor layer. This innovative method involves coating a solution and drying it to create a mesh-like structure with nanometer- to micrometer-sized pores, forming a printable porous anchor (PPA).

This PPA bonding technique allows for the combination of materials that are typically difficult to bond together, such as glass and flexible polymers. The adhesive layer achieves bonding strength exceeding 7 MPa, even when the materials have low adhesion to each other. The PPA achieves this strong bond through a hybrid approach, bonding to one material via chemical affinity and physically interlocking with the other through the tiny pores.

Multi-material structures, which combine hard and soft materials, are becoming increasingly important in various fields, including lightweight vehicles, flexible electronics, and soft robots. However, bonding these different materials has traditionally been a challenge, requiring the development of unique adhesives for each combination. This new method eliminates the need for customized adhesives, as the porous anchor layer can be adapted to accommodate a wide variety of material combinations.

The research team is also exploring additional applications for the porous anchor layer. They are developing versions with conductivity to facilitate heat dissipation and electrical connectivity at bonded interfaces. Additionally, they are working on heat-resistant materials to ensure the layer can withstand harsh environments. These advancements could significantly expand the versatility of the technology and meet the diverse bonding needs of the industrial sector.

This groundbreaking technology is expected to revolutionize manufacturing processes for next-generation products, such as mobility devices, wearables, and soft robotics, where multi-material structures will play a crucial role in the future.

Written by urgent.news from Phys.org's reporting — not their text. Machine-written — may contain errors; check the original before relying on it.

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