Wall Street banks, Blackstone line up $63 billion to finance Broadcom AI chips for Anthropic

Bank of America, Blackstone, Citi, and Morgan Stanley are joining forces to finance Broadcom's AI chips and networking gear for Anthropic, in what is described as one of the largest debt deals tied to the AI buildout. The financing structure includes $43.5 billion in first lien loans or senior debt, comprising 69% of the total financing, with Blackstone providing the committed portion of the second-lien financing.

Broadcom is offering residual value support to lenders, providing a significant guarantee. The deal comes as rising AI demand drives massive investment in computing infrastructure, and Anthropic prepares for a potentially record-breaking IPO despite facing disclosures of steep losses and security concerns.