Japan’s Sumitomo Bakelite expands China chip packaging materials output amid AI boom
Japanese semiconductor materials giant Sumitomo Bakelite plans to expand production of advanced chip packaging materials in China and Singapore, marking the second such announcement for its Chinese operations in less than four months as artificial intelligence drives demand for more sophisticated semiconductors. The Tokyo-based company said on Friday that it would add production lines for mould…
Japanese semiconductor materials company Sumitomo Bakelite is expanding its production of advanced chip packaging materials in China and Singapore, driven by the artificial intelligence boom that is increasing demand for sophisticated semiconductors. The company plans to add production lines for mould underfill materials and compression-moulding granules at its facilities in Suzhou, China, and Singapore, which will roughly double its production capacity for mould underfill materials and triple that for compression-moulding granules.
This investment underscores the critical role of advanced packaging materials in the semiconductor supply chain as the AI boom drives demand for more powerful chips with increasingly complex packaging structures.
Brief written by urgent.news from South China Morning Post's own syndicated text. Machine-written — may contain errors; check the original before relying on it.
