Samsung Electro Mechanics to add 1 85 billion semiconductor investment in Thai Nguyen
Samsung Electro Mechanics part of South Korean conglomerate Samsung Group plans to invest 1 85 billion to expand semiconductor packaging substrate production in Vietnam meeting growing demand from AI server and high performance processor markets
Samsung Electro-Mechanics plans to invest $1.85 billion in its semiconductor production facility in Vietnam, as reported by a September 29 press release. This investment is part of a total $5.05 billion expansion across the company's Sejong business site and Vietnam subsidiary. The funds will be used to increase FCBGA (flip-chip ball grid array) production capacity at the Sejong site and at the Vietnam subsidiary, with completion and operations expected by June 2030.
FCBGA is a crucial semiconductor component that enhances the performance and stability of AI and high-performance computing devices. The investment aims to meet rising global demand for high-value-added semiconductor substrates, particularly in AI servers, high-performance chips, and automotive electronics.
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