Samsung Electro-Mechanics Advances Glass Substrates
Samsung Electro-Mechanics is verifying package-level reliability by combining client chips with large glass substrates, which are drawing attention as next-generation semiconductor substrates. After providing samples to clients, the verification of the glass substrate itself has been completed. The
Samsung Electro-Mechanics is advancing its glass substrates technology by verifying package-level reliability and entering the verification stage for the package assembly of actual semiconductors. The company is collaborating with multiple large global enterprises to commercialize glass substrates, which are considered next-generation substrates for large and highly integrated AI semiconductors.
The glass substrate being developed by Samsung Electro-Mechanics is reported to be 100㎜×100㎜ in size, making it over 60% larger than Nvidia’s Blackwell GPU package substrate. The increased size of AI accelerators is driving the demand for larger substrates, as multiple chips are integrated into a single package, leading to challenges in maintaining precision and reducing warpage with existing organic material substrates.
Glass substrates, with their reduced warpage, high flatness, and dimensional stability, are seen as a promising solution for the next generation of AI semiconductors.
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